SLWSTK6000A Datasheet, PDF (73/80 Pages) Silicon Laboratories – ConfidentialMighty Gecko Wireless SoC EFR32MG1X232

EFR32MG1X232 Data Sheet
Pinout and Package
Dimension
Typ
L
0.86
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
C^{6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads.}
7. A 4x4 array of 0.75 mm square openings on a 1.00 mm pitch can be used for the center ground pad.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
o _{6.7 QFN48 Package Marking}
n_{YEPYFPRWPf3PW2iPTPdTPTPTePTT#nt Figure 6.5. QFN48 Package Marking}
i ^{The package marking consists of:}
• PPPPPPPPP – The part number designation.
a ^{• TTTTTT – A trace or manufacturing code. The first letter is the device revision.}
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
l ^{• # - The firmware revision.}
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