SI53154 Datasheet, PDF (20/22 Pages) Silicon Laboratories – PCI-EXPRESS GEN 1, GEN 2, GEN 3, AND GEN 4 QUAD FANOUT BUFFER

Si53154
Table 8. PCB Land Pattern Dimensions
Dimension
C1
Unit mm
4.0
C2
4.0
E
0.50 BSC
X1
0.30
X2
2.70
Y1
0.80
Y2
2.70
Notes:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
2. The stencil thickness should be 0.125mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 2x2 array of 1.10mm x 1.10mm openings on 1.30mm pitch should be used for
the center ground pad.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
20
Rev. 1.1