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SI4770-77-A20 Datasheet, PDF (19/54 Pages) Silicon Laboratories – HIGH-PERFORMANCE CONSUMER ELECTRONICS
Si4770/77-A20
Table 9. Thermal Conditions
Parameter
Symbol Test Conditions
Min
Typ
Max
Unit
Ambient Temperature
TAMB
—
–40
25
85
°C
Junction Temperature
TJ
—
—
—
115
°C
Delta from Junction to Ambient*
θJA
—
—
27
—
°C/W
*Note: The θJA is layout-dependent, and, therefore, PCB layout must provide adequate heat-sink capability. The θJA is
specified assuming adequate ground plane.
Table 10. Absolute Maximum Ratings1
Parameter
Symbol
Min
Max
Unit
Analog Supply Voltage
Digital Supply Voltage
I/O 1 Supply Voltage
I/O 2 Supply Voltage
I/O 1 Input Current2
I/O 1 Input Voltage2
I/O 2 Input Current3
I/O 2 Input Voltage3
Operating Temperature
Storage Temperature
AM RF Input Level4
AM RF Input Current4
FM RF Input Level5
FM RF Input Current5
HBM ESD
MM ESD
CDM ESD6
CDM ESD7
VA
–0.5
5.9
V
VD
–0.5
3.9
V
VIO1
–0.5
3.9
V
VIO2
–0.5
3.9
V
IIN1
–10
10
µA
VIN1
–0.3
VI01 + 0.3
V
IIN2
–10
10
µA
VIN2
–0.3
VI02 + 0.3
V
TOP
–40
95
°C
TSTG
–55
150
°C
VRFIN
–1
VA + 1
V
IRFIN
–100
100
mA
VRFIN
–1
1
V
IRFIN
–100
100
mA
VHBM
–2
2
kV
VMM
–200
200
V
VCDM
–500
500
V
VCDM
–750
750
V
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond recommended
operating conditions for extended periods may affect device reliability.
2. For input pins SCL, SDA, RSTB, A0, A1, GPIO1, GPIO2.
3. For input pins DCLK and DFS.
4. At RF input pins AM1.
5. At RF input pins FMXIN, FMXIP, FMI, FMAGC1, FMAGC2.
6. All pins.
7. Corner pins.
Rev. 0.9
19