SI5018 Datasheet, PDF (18/22 Pages) Silicon Laboratories – SiPHY™ OC-48/STM-16 CLOCK AND DATA RECOVERY IC WITH FEC

Si5018
Package Outline: Si5018-BM
Figure 11 illustrates the package details for the Si5018-BM. Table 9 lists the values for the dimensions shown in the
illustration.
PIN1 ID
0.50 DIA.
D
D1
20
1
2
3
E1 E
A
A1
A2
A3
b
θ
e
D2
L
20
b
1
2
3 E2
e
Top View
Side View
Bottom View
Figure 11. 20-pin Micro Leadframe Package (MLP)
Table 9. Package Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Nom
Max
Min
Nom
Max
A
—
0.85
0.90
D1, E1
3.75 BSC
A1
0.00
0.01
0.05
D2, E2 1.95
2.10
2.25
A2
—
0.65
0.70
e
0.50 BSC
A3
0.20 REF.
θ
—
—
12°
b
0.18
0.23
0.30
L
0.50
0.60
0.75
D, E
4.00 BSC
Notes:
1. Dimensioning and tolerances conform to ASME Y14.5M. - 1994
2. Package warpage MAX 0.05 mm.
3. “b” applies to plated terminal and is measured between 0.20 and 0.25 mm from terminal TIP.
4. The package weight is approximately 42 mg.
5. The mold compound for this package has a flammability rating of UL94-V0 with an oxygen index of 28
minimum/54 typical.
6. The recommended reflow profile for this package is defined by the JEDEC-020B Small Body specification.
18
Rev. 1.2