SI5010 Datasheet, PDF (17/20 Pages) List of Unclassifed Manufacturers – OC-12/3, STM-4/1 SONET/SDH CLOCK AND DATA RECOVERY IC

Si5010
8. Package Outline: Si5010-BM/GM
Figure 11 illustrates the package details for the Si5010-BM/GM. Table 9 lists the values for the dimensions shown
in the illustration.
PIN1 ID
0.50 DIA.
D
D1
20
1
2
3
E1 E
A
A1
A2
A3
b
θ
e
D2
L
20
b
1
2
3 E2
e
Top View
Side View
Bottom View
Figure 11. 20-pin Quad Flat No-Lead (QFN)
Table 9. Package Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Nom
Max
A
—
0.85
0.90
A1
0.00
0.01
0.05
A2
—
0.65
0.70
A3
0.20 REF.
b
0.18
0.23
0.30
D, E
4.00 BSC
D1, E1
D2, E2
e
θ
L
Min
Nom
Max
3.75 BSC
1.95
2.10
2.25
0.50 BSC
—
—
12°
0.50
0.60
0.75
Notes:
1. Dimensioning and tolerances conform to ASME Y14.5M. - 1994
2. Package warpage MAX 0.05 mm.
3. “b” applies to plated terminal and is measured between 0.20 and 0.25 mm from terminal TIP.
4. The package weight is approximately 42 mg.
5. The mold compound for this package has a flammability rating of UL94-V0 with an oxygen index of 28
minimum/54 typical.
6. The recommended reflow profile for this package is defined by the JEDEC-020B Small Body specification.
Rev. 1.3
17