EFM8BB1 Datasheet, PDF (17/46 Pages) Silicon Laboratories – The EFM8BB1 highlighted features are listed below

Parameter
Symbol
Input High Voltage
V_IH
Input Low Voltage
V_IL
Pin Capacitance
C_IO
Weak Pull-Up Current
I_PU
(V_IN = 0 V)
Input Leakage (Pullups off or Ana- I_LK
log)
Input Leakage Current with V_IN
I_LK
above V_DD
Test Condition
V_DD = 3.6
GND < V_IN < V_DD
V_DD < V_IN < V_DD+2.0 V
Min
V_DD – 0.6
—
—
–30
EFM8BB1 Data Sheet
Electrical Specifications
Typ
Max
Unit
—
—
V
—
0.6
V
7
—
pF
–20
–10
µA
–1.1
—
1.1
µA
0
5
150
µA
4.2 Thermal Conditions
Table 4.12. Thermal Conditions
Parameter
Symbol Test Condition
Min
Typ
Thermal Resistance*
θ_JA
SOIC-16 Packages
QFN-20 Packages
—
70
—
60
QSOP-24 Packages
—
65
Note:
1. Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.
Max
Unit
—
°C/W
—
°C/W
—
°C/W
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