HYB3164160T Datasheet, PDF (26/26 Pages) Siemens Semiconductor Group – 4M x 16-Bit Dynamic RAM

Package Outlines
P-TSOPII-54-1 (500 mil)
(Plastic Thin Small Outline Package Type II
HYB 3164(5)160T-50/-60
4M x 16-DRAM
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
30
Dimensions in mm