GX3290 Datasheet, PDF (46/47 Pages) Semtech Corporation – 290 x 290 3.5Gb/s Crosspoint Switch

6.4 Solder Reflow Profile
The GX3290 is available in a Pb-free package. It is recommended that the Pb-free
package be soldered with Pb-free paste using the reflow profile shown in Figure 6-3.
Device Surface Temperature (°C)
250
1.0 - 2.0°C/s
200
180°C
Pre Heating Zone
150
150°C
60 - 120s
100
50
1.0 - 2.0°C/s
Peak 245°C
230°C
Soldering
Zone
10 - 15s
1.5 - 2.0°C/s
Heating Time
Figure 6-3: Maximum Pb-free Solder Reflow Profile
6.5 Ordering Information
Table 6-2: Ordering Information
Part Number
GX3290-CBE3
Package
50x50mm HFC-BGA
Temperature Range
0°C to 85°C
Appendix - Relevant Documentation
Table 6-3: Relevant Documentation
Document Description
Document Identification
EB-GX3290 Schematics, PCB Layout and Bill of Materials
GX3290 Host Control Software User Manual
Using the Monitoring Features of the GX3290 Application Note
GX3290 (and family) Crosspoint Ball Guide
Crosspoint Design Guide
Crosspoint (GX3290 and family) Reference Manual (for CSRs)
GENDOC-056057
GENDOC-055970
GENDOC-058329
GENDOC-056697
GENDOC-056004
GENDOC-056832
GX3290 290 x 290 3.5Gb/s Crosspoint
Final Data Sheet Rev. 2
GENDOC-053317 March 2013
www.semtech.com
46 of 47
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