LC86P6032 Datasheet, PDF (6/22 Pages) Sanyo Semicon Device – 8-Bit Single Chip Microcontroller with One-Time PROM

Pin Assignment
LC86P6032
TEST1
49
RES
50
XT1
51
XT2
52
VSS
53
CF1
54
CF2
55
VDD
56
P80/AN0
57
P81/AN1
58
P82/AN2
59
P83/AN3
60
P70/INT0
61
P71/INT1
62
72/INT2/T0IN
63
73/INT3/T0IN
64
32
S29
31
S28
30
S27
29
S26
28
S25
27
S24
26
S23
25
S22
24
S21
23
S20
22
S19
21
S18
20
S17
19
S16
18
VP
17
VDDVPP
Package Dimension
(unit : mm)
3159
SANYO : QIP-64E
Notes
• The QFP packages should be heat-soaked for 24 hours at 125°C immediately prior to mounting (This baking is called
pre-baking).
• After pre-baking, a controlled environment must be maintained until soldering. The environment must be held at a
temperature of 30°C or less and a humidity level of 70% or less. Please solder within 8 hours.
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