K4T1G044QC Datasheet, PDF (7/26 Pages) Samsung semiconductor – 1Gb C-die DDR2 SDRAM Specification

K4T1G044QC
K4T1G084QC
3.3 FBGA Package Dimension(x4/x8)
MOLDING AREA
11.00 ± 0.10
0.80x8=6.40
3.20
0.80
1.60
987654321
(Datum A) A
B
(Datum B) C
D
E
F
G
H
J
K
L
A
#A1 MARK
B
(0.95)
60 - ∅0.45 Solder ball
(Post reflow 0.50 ± 0.05
0.20 M A B
(1.90)
11.00 ± 0.10
#A1
DDR2 SDRAM
7 of 26
0.35 ± 0.05
1.10 ± 0.10
Rev. 1.1 June 2007