K4T1G044QC Datasheet, PDF (5/26 Pages) Samsung semiconductor – 1Gb C-die DDR2 SDRAM Specification

K4T1G044QC
K4T1G084QC
3.0 Package Pinout/Mechanical Dimension & Addressing
3.1 x4 package pinout (Top View) : 60ball FBGA Package
1
2
3
7
8
9
VDD NC VSS A VSSQ DQS VDDQ
NC VSSQ DM B DQS VSSQ NC
VDDQ DQ1 VDDQ C VDDQ DQ0 VDDQ
NC VSSQ DQ3 D DQ2 VSSQ NC
VDDL VREF VSS E VSSDL CK VDD
CKE WE F RAS CK ODT
BA2 BA0 BA1 G CAS CS
A10/AP A1
H
A2
A0 VDD
VSS A3
A5
J
A6
A4
A7
A9
K
A11
A8
VSS
VDD A12
NC
L
NC A13
Note :
1. Pin A3 has identical capacitance as pin A7.
2. VDDL and VSSDL are power and ground for the DLL.
DDR2 SDRAM
Ball Locations (x4)
: Populated Ball
+ : Depopulated Ball
Top View (See the balls through the Package)
123456789
A
+ ++
B
+ ++
C
+ ++
D
+ ++
E
+ ++
F₊
+ ++
G
+ ++
+
H₊
+ ++
J
+ ++
+
K₊
+ ++
L
+ ++
+
5 of 26
Rev. 1.1 June 2007