K4T1G044QC Datasheet, PDF (2/26 Pages) Samsung semiconductor – 1Gb C-die DDR2 SDRAM Specification

K4T1G044QC
K4T1G084QC
DDR2 SDRAM
Table of Contents
1.0 Ordering Information ................................................................................................................... 4
2.0 Key Features ................................................................................................................................. 4
3.0 Package Pinout/Mechanical Dimension & Addressing ............................................................ 5
3.1 x4 package pinout (Top View) : 60ball FBGA Package ....................................................................... 5
3.2 x8 package pinout (Top View) : 60ball FBGA Package ....................................................................... 6
3.3 FBGA Package Dimension(x4/x8) ................................................................................................... 7
4.0 Input/Output Functional Description .......................................................................................... 8
5.0 DDR2 SDRAM Addressing .......................................................................................................... 9
6.0 Absolute Maximum DC Ratings ................................................................................................ 10
7.0 AC & DC Operating Conditions ................................................................................................ 10
7.1 Recommended DC Operating Conditions (SSTL - 1.8) ..................................................................... 10
7.2 Operating Temperature Condition ................................................................................................. 11
7.3Input DC Logic Level .................................................................................................................... 11
7.4 Input AC Logic Level ................................................................................................................... 11
7.5 AC Input Test Conditions ............................................................................................................. 11
7.6 Differential input AC logic Level ................................................................................................... 12
7.7 Differential AC output parameters ................................................................................................. 12
8.0 ODT DC electrical characteristics ............................................................................................ 12
9.0 OCD default characteristics ...................................................................................................... 13
10.0 IDD Specification Parameters and Test Conditions ............................................................. 14
11.0 DDR2 SDRAM IDD Spec Table ................................................................................................ 16
12.0 Input/Output capacitance ........................................................................................................ 17
13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 ..................................... 17
13.1 Refresh Parameters by Device Density ...................................................................................... 17
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ............................................ 17
13.3 Timing Parameters by Speed Grade ........................................................................................... 18
14.0 General notes, which may apply for all AC parameters ....................................................... 20
15.0 Specific Notes for dedicated AC parameters ........................................................................ 22
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Rev. 1.1 June 2007