PD64A_15 Datasheet, PDF (57/66 Pages) Renesas Technology Corp – 4-BIT SINGLE-CHIP MICROCONTROLLERS FOR INFRARED REMOTE CONTROL TRANSMISSION

µPD64A, 65
15. RECOMMENDED SOLDERING CONDITIONS
The µPD64A and 65 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representa-
tive.
Table 15-1. Surface Mounting Type Soldering Conditions
µPD64AMC-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))
µPD65MC-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235°C, time: 30 seconds max. (210°C or higher),
count: three times or less
Package peak temperature: 215°C, time: 40 seconds max. (200°C or higher),
count: three times or less
Solder bath temperature: 260°C max., time: 10 seconds max, count: once,
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U14380EJ3V0DS00
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