H8S2378 Datasheet, PDF (41/1203 Pages) Renesas Technology Corp – Renesas 16-Bit Single-Chip Microcomputer H8S Family/H8S/2300 Series

26.2.6 Flash Memory Characteristics............................................................................ 1049
26.3 Electrical Characteristics for H8S/2374, H8S/2372, H8S/2371, H8S/2370,
H8S/2378R, H8S/2374R, H8S/2372R, H8S/2371R, H8S/2370R................................... 1050
26.3.1 Absolute Maximum Ratings .............................................................................. 1050
26.3.2 DC Characteristics ............................................................................................. 1051
26.3.3 AC Characteristics ............................................................................................. 1054
26.3.4 A/D Conversion Characteristics......................................................................... 1063
26.3.5 D/A Conversion Characteristics......................................................................... 1063
26.3.6 Flash Memory Characteristics............................................................................ 1064
26.4 Timing Charts ................................................................................................................. 1067
26.4.1 Clock Timing ..................................................................................................... 1067
26.4.2 Control Signal Timing ....................................................................................... 1069
26.4.3 Bus Timing ........................................................................................................ 1070
26.4.4 DMAC and EXDMAC Timing.......................................................................... 1088
26.4.5 Timing of On-Chip Peripheral Modules ............................................................ 1091
Appendix ................................................................................................................................ 1095
A. I/O Port States in Each Pin State..................................................................................... 1095
B. Product Lineup................................................................................................................ 1105
C. Package Dimensions ....................................................................................................... 1106
D. Bus State during Execution of Instructions..................................................................... 1108
Index ........................................................................................................................................ 1131
Rev. 6.00 Jul 19, 2006 page xli of lxiv