TLK2211 Datasheet, PDF (2/21 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK2211
SLLS873B – MAY 2008 – REVISED JULY 2008 ................................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The primary application of this device is to provide building blocks for point-to-point baseband data transmission
over controlled impedance media of 50 Ω or 75 Ω. The transmission media can be printed-circuit board traces,
copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the
attenuation characteristics of the media and the noise coupling to the environment.
The TLK2211 performs the data serialization, deserialization, and clock extraction functions for a physical layer
interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over
a copper or optical media interface.
The TLK2211 supports a standard 10-bit interface (TBI) . In the TBI mode the serializer/deserializer (SERDES)
accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted
differentially at PECL compatible voltage levels. The SERDES extracts clock information from the input serial
stream and deserializes the data, outputting a parallel 10-bit data byte.
The TLK2211 provides a comprehensive series of built-in tests for self-test purposes including loopback and
pseudo random binary sequence (PRBS) generation and verification. An IEEE 1149.1 JTAG port is also
supported.
The TLK2211 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use of
the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is
an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is
recommended that the TLK2211 PowerPADs be soldered to the thermal land on the board.
The TLK2211 is characterized for operation from –40°C to 85°C.
The TLK2211 use a 3.3-V supply. The I/O section is 3.3-V compatible. With the 3.3-V supply the chipset is very
power-efficient, dissipating less than 600 mW typical power when operating at 1.25 Gbps.
The TLK2211 is designed to be hot plug capable. A power-on reset causes RBC0, RBC1, the parallel output
signal terminals, TXP, and TXN to be held in high-impedance state.
Differences Between TLK2211, and TNETE2201
The TLK2211 is a functional equivalent of the TNETE2201. There are several differences between the devices
as noted below. Refer to Figure 10 in the application information section for an example of a typical application
circuit.
• The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required. The TLK2211
uses these pins to provide added test capabilities. The capacitors, if present, do not affect the operation of
the device.
• No pulldown resistors are required on the TXP/TXN outputs.
T_A
–40°C to 85°C
AVAILABLE OPTIONS
PACKAGE ⁽¹⁾
PLASTIC QUAD FLAT PACK (RCP)
TLK2211RCP
TLK2211RCPR
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
2
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