TLK2211 Datasheet, PDF (15/21 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK2211
www.ti.com ................................................................................................................................................................ SLLS873B – MAY 2008 – REVISED JULY 2008
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report (SLMA002), available via the TI Web pages beginning at URL:
http://www.ti.com.
Figure 11. Example of a Thermal Land
For the TLK2211, this thermal land must be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground pin landing pads be connected directly to the grounded thermal land. The land size must
be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed
PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout (SLLA020).
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s) :TLK2211
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