HYS72T512022EP Datasheet, PDF (4/36 Pages) Qimonda AG – 240-Pin Dual Die Registered DDR2 SDRAM Modules

Internet Data Sheet
HYS72T[512/1G]0x2EP–[3S/3.7]–B
Registerd DDR2 SDRAM Module
1.2
Description
The Qimonda HYS72T512022EP–[3S/3.7]–B module family
are Registered DIMM (with parity) modules with 30 mm height
based on DDR2 technology.
DIMMs are available as ECC modules in 512M × 72 (4 GB)
organization and density, intended for mounting into 240-Pin
connector sockets.
The memory array is designed with 1-Gbit Double-Data-Rate-
Two (DDR2) Synchronous DRAMs. All control and address
signals are re-driven on the DIMM using register devices and
a PLL for the clock distribution. This reduces capacitive
loading to the system bus, but adds one cycle to the SDRAM
timing. Decoupling capacitors are mounted on the PCB
board. The DIMMs feature serial presence detect based on a
serial E²PROM device using the 2-pin I²C protocol. The first
128 bytes are programmed with configuration data and the
second 128 bytes are available to the customer.
Product Type¹⁾
Compliance Code²⁾
TABLE 1
Ordering Information for RoHS Compliant Products
Description
SDRAM
Technology
PC2–4200
HYS72T512022EP–3.7–B
4 GB 2R×4 PC2–4200P–444–12–K0 2 Ranks, ECC
2 × 256 Mbit (×4)
PC2–5300
HYS72T512022EP–3S–B
4 GB 2R×4 PC2–5300P–555–12–K0 2 Ranks, ECC
2 × 256 Mbit (×4)
1) All Product Type number end with a place code, designating the silicon die revision. Example: HYS72T512022EP–3.7–B, indicating Rev.
“B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data
sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200R–444–12–F0”, where 4200P
means Registered DIMM modules (with Parity Bit) with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe
(CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2
and produced on the Raw Card “F”
DIMM
Density
4 GByte
Module
Organization
512M × 72
Memory
Ranks
2
ECC/
Non-ECC
ECC
TABLE 2
Address Format Table
# of SDRAMs # of row/bank/column
bits
Raw
Card
36
14/3/11
K
Product Type¹⁾
DRAM Components¹⁾²⁾
DRAM Density
TABLE 3
Components on Modules
DRAM Organisation
HYS72T512022ER
HYB18T2G402BF
2 × 1 Gbit
2 × 256M × 4
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.0, 2007-03
4
03292007-RHOW-C5L6