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HYS72T512022EP Datasheet, PDF (15/36 Pages) Qimonda AG – 240-Pin Dual Die Registered DDR2 SDRAM Modules
Internet Data Sheet
HYS72T[512/1G]0x2EP–[3S/3.7]–B
Registerd DDR2 SDRAM Module
3.3
Timing Characteristics
This chapter describes the timing characteristics.
3.3.1
Speed Grade Definitions
All Speed grades faster than DDR2-400B comply with DDR2-400B timing specifications(tCK = 5ns with tRAS = 40ns).
Speed Grade Definitions: Table 11 for DDR2–667D, Table 12 for DDR2–533C
Speed Grade
TABLE 11
Speed Grade Definition Speed Bins for DDR2–667D
DDR2–667D
Unit
Note
QAG Sort Name
–3S
CAS-RCD-RP latencies
5–5–5
tCK
Parameter
Symbol
Min.
Max.
—
Clock Frequency
@ CL = 3
tCK
5
8
ns
1)2)3)4)
@ CL = 4
tCK
3.75
8
ns
1)2)3)4)
@ CL = 5
tCK
3
8
ns
1)2)3)4)
Row Active Time
tRAS
45
70000
ns
1)2)3)4)5)
Row Cycle Time
tRC
60
—
ns
1)2)3)4)
RAS-CAS-Delay
tRCD
15
—
ns
1)2)3)4)
Row Precharge Time
tRP
15
—
ns
1)2)3)4)
1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode.Timings are further guaranteed for normal
OCD drive strength (EMRS(1) A1 = 0)
2) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS,
input reference level is the crosspoint when in differential strobe mode
3) Inputs are not recognized as valid until VREF stabilizes. During the period before VREF stabilizes, CKE = 0.2 x VDDQ is recognized as low.
4) The output timing reference voltage level is VTT.
5) tRAS.MAX is calculated from the maximum amount of time a DDR2 device can operate without a refresh command which is equal to 9 x tREFI.
Rev. 1.0, 2007-03
15
03292007-RHOW-C5L6