BUK78150-55A Datasheet, PDF (9/13 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK78150-55A
TrenchMOS™ standard level FET
9. Package outline
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
D
B
E
A
X
c
y
H_E
b₁
4
vM A
A₁
1
2
3
e₁
b_p
e
wM B
Q
A
L_p
detail X
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A₁ b_p b₁
c
D
E
e
e₁ H_E L_p
Q
v
w
y
mm
1.8 0.10 0.80 3.1 0.32 6.7
1.5 0.01 0.60 2.9 0.22 6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
IEC
SOT223
Fig 16. SOT223 (SC-73).
9397 750 07738
Product specification
REFERENCES
JEDEC
EIAJ
SC-73
Rev. 01 — 30 January 2001
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
© Philips Electronics N.V. 2001. All rights reserved.
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