BUK78150-55A Datasheet, PDF (10/13 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
10. Soldering
1.20
(4x)
7.40
7.00
3.85
3.60
3.50
0.30
4
BUK78150-55A
TrenchMOS™ standard level FET
3.90 4.80 7.65
solder lands
solder resist
occupied area
solder paste
1
2
3
1.20 (3x)
1.30 (3x)
5.90
6.15
Dimensions in mm.
Fig 17. Reflow soldering footprint for SOT223 (SC-73).
MSA443
11. Revision history
Table 6: Revision history
Rev Date
CPCN
01 20010130 -
Description
Product specification; initial version.
9397 750 07738
Product specification
Rev. 01 — 30 January 2001
© Philips Electronics N.V. 2001. All rights reserved.
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