BUK78150-55A Datasheet, PDF (4/13 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK78150-55A
TrenchMOS™ standard level FET
7. Thermal characteristics
Table 4: Thermal characteristics
Symbol Parameter
R_th(j-a)
R_th(j-sp)
thermal resistance from junction to ambient
thermal resistance from junction to solder
point
Conditions
Figure 4
7.1 Transient thermal impedance
Value Unit
70
K/W
15
K/W
102
Zth(j-sp)
(K/W)
10
δ = 0.5
0.2
0.1
1
0.05
0.02
10-1
Single Shot
10-2
10-6
10-5
10-4
10-3
10-2
03nc18
P
δ
=
tp
T
10-1
tp
t
T
1 tp (s) 10
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
9397 750 07738
Product specification
Rev. 01 — 30 January 2001
© Philips Electronics N.V. 2001. All rights reserved.
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