BUK78150-55A Datasheet, PDF (2/13 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK78150-55A
TrenchMOS™ standard level FET
5. Quick reference data
Table 2: Quick reference data
Symbol Parameter
V_DS
I_D
P_tot
T_j
R_DSon
drain-source voltage (DC)
drain current (DC)
total power dissipation
junction temperature
drain-source on-state resistance
6. Limiting values
Conditions
T_sp = 25 °C; V_GS = 10 V
T_sp = 25 °C
V_GS = 10 V; I_D = 5 A
T_j = 25 °C
T_j = 150 °C
Typ
Max Unit
−
55
V
−
5.5
A
−
8
W
−
150
°C
128
150
mΩ
−
278
mΩ
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max Unit
V_DS
V_DGR
V_GS
I_D
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
I_DM
peak drain current
P_tot
total power dissipation
T_stg
storage temperature
T_j
operating junction temperature
−
55
V
R_GS = 20 kΩ
−
55
V
−
±20
V
T_sp = 25 °C; V_GS = 10 V; Figure 2 and 3
−
5.5
A
T_sp = 100 °C; V_GS = 10 V; Figure 2
−
3.8
A
T_sp = 25 °C; pulsed; t_p ≤ 10 µs; Figure 3
−
22
A
T_sp = 25 °C; Figure 1
−
8
W
−55
+150 °C
−55
+150 °C
Source-drain diode
I_DR
I_DRM
reverse drain current (DC)
pulsed reverse drain current
T_sp = 25 °C
T_sp = 25 °C; pulsed; t_p ≤ 10 µs
−
5.5
A
−
22
A
Avalanche ruggedness
W_DSS non-repetitive avalanche energy
unclamped inductive load; I_D = 5 A;
V_DS ≤ 55 V; V_GS = 10 V; R_GS = 50 Ω;
starting T_sp = 25 °C
−
25
mJ
9397 750 07738
Product specification
Rev. 01 — 30 January 2001
© Philips Electronics N.V. 2001. All rights reserved.
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