BTA2008W-800D Datasheet, PDF (7/15 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
6.3
2.3
Fig. 7.
4.6
All dimensions are in mm
001aab508
Minimum footprint SOT223
BTA2008W-800D
3Q Hi-Com Triac
36
18
60
9
4.6
4.5
10
Fig. 8.
7
15
50
001aab509
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Printed circuit board pad area: SOT223
BTA2008W-800D
Product data sheet
All information provided in this document is subject to legal disclaimers.
14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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