BTA2008W-800D Datasheet, PDF (6/15 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
BTA2008W-800D
3Q Hi-Com Triac
8. Thermal characteristics
Table 5.
Symbol
R_th(j-sp)
R_th(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance
from junction to solder
point
full cycle; Fig. 6
thermal resistance
from junction to
ambient
in free air; printed-circuit board
mounted: minimum footprint; Fig. 7
in free air; printed-circuit board
mounted: minimum pad area; Fig. 8
10²
Z _th(j-sp)
(K/W)
10
Min Typ Max Unit
-
-
15
K/W
-
156 -
K/W
-
70
-
K/W
003aac210
1
P
10^-1
10^-2_10-5
10^-4
10^-3
10^-2
10^-1
t_p
t
1
10
t_p (s)
Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width
BTA2008W-800D
Product data sheet
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14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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