BTA2008W-800D Datasheet, PDF (12/15 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
BTA2008W-800D
3Q Hi-Com Triac
11. Soldering
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1
2
3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
Fig. 15. Reflow soldering footprint for SC-73 (SOT223)
8.9
6.7
1.9
4
1
2
3
2.7
2.7
1.1
1.9
(2×)
Fig. 16. Wave soldering footprint for SC-73 (SOT223)
6.2
8.7
1.9
(3×)
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
BTA2008W-800D
Product data sheet
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14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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