BTA2008W-800D Datasheet, PDF (15/15 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
13. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Limiting values .......................................................3
8
Thermal characteristics .........................................6
9
Characteristics ....................................................... 8
10 Package outline ................................................... 11
11 Soldering .............................................................. 12
12 Legal information .................................................13
12.1 Data sheet status ............................................... 13
12.2 Definitions ...........................................................13
12.3 Disclaimers .........................................................13
12.4 Trademarks ........................................................ 14
© NXP Semiconductors N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 14 August 2014
BTA2008W-800D
3Q Hi-Com Triac
BTA2008W-800D
Product data sheet
All information provided in this document is subject to legal disclaimers.
14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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