BTA2008-1000D Datasheet, PDF (6/13 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
BTA2008-1000D
3Q Hi-Com Triac
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
R_th(j-lead)
thermal resistance
from junction to lead
R_th(j-a)
thermal resistance
from junction to
ambient
Conditions
full cycle; Fig. 6
printed circuit board mounted: lead
length = 4 mm
10²
Z_th(j-lead)
(K/W)
10
Min Typ Max Unit
-
-
60
K/W
-
150 -
K/W
003aac206
1
P
10^-1
10^-2
10^-5
10^-4
10^-3
10^-2
10^-1
t_p
t
1
t_p (s)
10
Fig. 6. Transient thermal impedance from junction to lead as a function of pulse width
BTA2008-1000D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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