BTA2008-1000D Datasheet, PDF (10/13 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
11. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
BTA2008-1000D
3Q Hi-Com Triac
SOT54
c
E
d
1
D
2
3
b₁
A
L
L1
b
e1
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
b
b1
c
D
d
mm
5.2
5.0
0.48 0.66 0.45
0.40 0.55 0.38
4.8
4.4
1.7
1.4
E
e
e1
L
L₁⁽¹⁾
max.
4.2
3.6
2.54 1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT54
TO-92
SC-43A
ISSUE DATE
04-06-28
04-11-16
Fig. 12. Package outline TO-92 (SOT54)
BTA2008-1000D
All information provided in this document is subject to legal disclaimers.
Product data sheet
11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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