BTA2008-1000D Datasheet, PDF (13/13 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
13. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................3
9
Thermal characteristics .........................................6
10 Characteristics ....................................................... 7
11 Package outline ................................................... 10
12 Legal information .................................................11
12.1 Data sheet status ............................................... 11
12.2 Definitions ...........................................................11
12.3 Disclaimers .........................................................11
12.4 Trademarks ........................................................ 12
© NXP Semiconductors N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 11 June 2014
BTA2008-1000D
3Q Hi-Com Triac
BTA2008-1000D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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