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PMDPB70XPE_15 Datasheet, PDF (3/15 Pages) NXP Semiconductors – 20 V dual P-channel Trench MOSFET
NXP Semiconductors
PMDPB70XPE
20 V dual P-channel Trench MOSFET
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
ESD maximum rating
VESD
electrostatic discharge voltage
Per device
HBM; C = 100 pF; R = 1.5 kΩ
Tj
Tamb
Tstg
junction temperature
ambient temperature
storage temperature
Min Max Unit
[3]
-
2000 V
-55 150 °C
-55 150 °C
-65 150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm2.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[3] Measured between all pins.
120
Pder
(%)
80
017aaa123
120
Ider
(%)
80
017aaa124
40
40
0
−75
−25
25
75
125
175
Tj (°C)
0
−75
−25
25
75
125
175
Tj (°C)
Fig 1. Normalized total power dissipation as a
function of junction temperature
Fig 2. Normalized continuous drain current as a
function of junction temperature
PMDPB70XPE
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 June 2012
© NXP B.V. 2012. All rights reserved.
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