TDA8002C Datasheet, PDF (23/28 Pages) NXP Semiconductors – IC card interface

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VDD
3.3 V or 5 V J1 1
C1
100 nF
ground J1 2
C2
10 µF
C4 C8
C3 C7
C2 C6
C1 C5
C5I C1I
C6I C2I
C7I C3I
C8I C4I
CARD READ
C3⁽²⁾
100 nF
(1) _K1
K2
C4⁽³⁾
100 nF
C9
100 nF
33 pF
33 pF
VDD
14.745 MHz
CMDVCC
VCC
RST
CLK
AUX1
CV/TV
PRES
AUX2
25 26 27 28 29 30 31 32
24
1
23
2
22
3
21
IC1
4
20
TDA8002CG
5
19
6
18
7
17
8
16 15 14 13 12 11 10 9
AUX1UC
AUX2UC
CS
ALARM
CLKSEL
CLKDIV1
CLKDIV2
STROBE
C6⁽⁵⁾
470 nF
C5⁽⁴⁾
470 nF
C7
100 nF
C8
10 µF
VDD
P1-0
1
P1-1 ₂
P1-2
3
P1-3
4
P1-4
5
P1-5 ₆
P1-6
7
P1-7 ₈
RST ₉
P3-0 ₁₀
P3-1 ₁₁
P3-2 ₁₂
P3-3
13
P3-4 ₁₄
P3-5
15
P3-6 ₁₆
P3-7
17
XTAL2
18
XTAL1
19
VSS ₂₀
IC2
80C51
VCC
40
39 ^P0-0
P0-1
38
P0-2
37
P0-3
36
P0-4
35
P0-5
34
P0-6
33
P0-7
32
EA
31
ALE
30
PSEN
29
P2-7
28
P2-6
27
P2-5
26
P2-4
25
P2-3
24
P2-2
23
P2-1
22
P2-0
21
FCE196
TDA8002C should be placed as close as possible to the card reader.
(1) Contact normally open.
(2) C3 close to pin V_CC of TDA8002C.
(3) C4 close to C1 contact of card reader.
(4) C5 close to VUP pin of TDA8002C.
(5) C6 as close as possible to pins S1 and S2.
VDD
CLK line may be shielded with respect to other lines.
Decoupling capacitors C7, C8 and C9 may be placed as close as possible to pin V_DDA and V_DDD.
A good ground plane is recommended.
Fig.17 Application diagram (for more details, see “Application note AN98054”).