TDA8002C Datasheet, PDF (22/28 Pages) NXP Semiconductors – IC card interface

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VDD
3.3 V or 5 V J1 1
C1
100 nF
C2
10 µF
ground J1 2
33 pF
33 pF
C4 C8
C3 C7
C2 C6
C1 C5
C5I C1I
C6I C2I
C7I C3I
C8I C4I
CARD READ
(1) _K1
K2
C3⁽²⁾
100
nF
C4⁽³⁾
100 nF
MODE
28
OFF
27
XTAL1
1
XTAL2
2
14.745
MHz
RSTIN
26
I/OUC
3
CMDVCC
25
VCC
24
AUX1UC
4
CS
5
RST
23
6 ^ALARM
CLK
22
IC1
CLKSEL
7
AUX1 TDA8002CT/C CLKDIV1
21
8
CV/TV ₂₀
CLKDIV2
9
PRES
19
STROBE
10
I/O
18
CLKOUT
11
VUP
17
12 ^DGND1
C6⁽⁵⁾
S1
16
VDDA ₁₅
AGND
13
S2
14
470 nF
C5⁽⁴⁾
470 nF
C7
100 nF
C8
10 µF
VDD
VDD
P1-0
1
P1-1 ₂
P1-2 ₃
P1-3
4
P1-4
5
P1-5 ₆
P1-6
7
P1-7 ₈
RST ₉
P3-0 ₁₀
P3-1 ₁₁
P3-2 ₁₂
P3-3
13
P3-4 ₁₄
P3-5
15
P3-6 ₁₆
P3-7
17
XTAL2 ₁₈
XTAL1
19
VSS
20
IC2
80C51
VCC
40
P0-0
39
P0-1
38
P0-2
37
P0-3
36
P0-4
35
P0-5
34
33 ^P0-6
P0-7
32
EA
31
ALE
30
PSEN
29
P2-7
28
P2-6
27
P2-5
26
P2-4
25
P2-3
24
P2-2
23
P2-1
22
P2-0
21
FCE195
TDA8002C should be placed as close as possible to the card reader.
(1) Contact normally open.
(2) C3 close to pin V_CC of TDA8002C.
(3) C4 close to C1 contact of card reader.
(4) C5 close to VUP pin of TDA8002C.
(5) C6 as close as possible to pins S1 and S2.
CLK line may be shielded with respect to other lines.
Decoupling capacitors C7 and C8 may be placed as close as possible to pin V_DDA.
A good ground plane is recommended.
Fig.16 Application diagram.