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TDA8002C Datasheet, PDF (17/28 Pages) NXP Semiconductors – IC card interface
◁
Philips Semiconductors
IC card interface
Product specification
TDA8002C
CHARACTERISTICS
VDD = 3.3 V; Tamb = 25 °C; fxtal = 10 MHz; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
Supplies
VDD
IDD(lp)
IDD(idle)
IDD(active)
Vth2
supply voltage
supply current
supply current
supply current
threshold voltage on VDD for
voltage supervisor
low-power mode
Idle mode; fCLKOUT = 10 MHz
active mode; VCC(O) = 5 V;
fCLKOUT = 10 MHz
fCLK = LOW; ICC = 100 µA
fCLK = 5 MHz; ICC = 10 mA
fCLK = 5 MHz; ICC = 55 mA
active mode; VCC(O) = 3 V;
fCLKOUT = 10 MHz
fCLK = LOW; ICC = 100 µA
fCLK = 5 MHz; ICC = 10 mA
fCLK = 5 MHz; ICC = 55 mA
falling
Vhys2
hysteresis on Vth2
Card supply
VCC(O)
output voltage
ICC(O)
SR
output current
slew rate
Idle mode
active mode
VCC = 5 V; ICC < 55 mA;
DC load
ICC = 40 nAs; AC load
VCC = 3 V; ICC < 55 mA;
DC load
ICC = 24 nAs; AC load
VCC(O) = from 0 to 5 or 3 V
VCC short-circuited to ground
rising or falling slope
Crystal connections (XTAL1 and XTAL2)
Cext
external capacitors
note 1
fxtal
resonance frequency
note 2
MIN.
3
−
−
−
−
−
−
−
−
2.2
50
−
4.6
4.6
2.76
2.76
−
−
0.10
−
2
TYP.
MAX.
−
6.5
−
150
−
5
−
8
−
50
−
140
−
8
−
50
−
140
−
2.4
100
150
−
0.3
−
5.4
−
5.4
−
3.24
−
3.24
−
55
200
−
0.15
0.20
15
−
−
24
UNIT
V
µA
mA
mA
mA
mA
mA
mA
mA
V
mV
V
V
V
V
V
mA
mA
V/µs
pF
MHz
1999 Oct 12
17
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