TDA8002C Datasheet, PDF (16/28 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8002C
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
V_DDD
V_DDA
V_CC
V_i(card)
V_es
T_stg
P_tot
T_amb
T_j
PARAMETER
CONDITIONS
digital supply voltage
analog supply voltage
card supply voltage pins;
XTAL1, XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC, AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF
input voltage on card contact pins;
I/O, AUX2, PRES, PRES, AUX1, CLK,
RST and V_CC
electrostatic handling voltage
on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and V_CC
on all other pins
storage temperature
continuous total power dissipation
TDA8002CT/x
TDA8002CG
ambient temperature
T_amb = −25 to +85 °C
T_amb = −25 to +85 °C
junction temperature
MIN.
−0.3
−0.3
−0.3
MAX.
+6.5
+6.5
+6.5
UNIT
V
V
V
−0.3
+6.5
V
−6
+6
kV
−2
+2
kV
−55
+125
°C
−
0.56
W
−
0.46
W
−25
+85
°C
−
150
°C
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.
THERMAL CHARACTERISTICS
SYMBOL
R_th(j-a)
PARAMETER
thermal resistance from junction to ambient
SOT136-1
SOT401-1
CONDITIONS
in free air
VALUE
70
91
UNIT
K/W
K/W
1999 Oct 12
16