TDA8586 Datasheet, PDF (20/24 Pages) NXP Semiconductors – Power amplifier with load detection and auto BTL/SE selection

Philips Semiconductors
Power amplifier with load detection and
auto BTL/SE selection
Preliminary specification
TDA8586
HSOP20: heatsink small outline package; 20 leads; low stand-off
SOT418-2
D
y
D1
1
pin 1 index
20
Z
e
E
x
c
E2
HE
A
X
vM A
D2
10
E1
11
wM
bp
A2
A4
detail X
Q
A
(A3)
θ
Lp
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A2
A3 A4⁽¹⁾
bp
c D⁽²⁾ D1 D2 E⁽²⁾ E1 E2
e
HE Lp
Q
vw x
y
Z
θ
mm
3.5
3.5
3.2
0.35
+0.12
−0.02
0.53
0.40
0.32 16.0
0.23 15.8
13.0
12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1.27
14.5
13.9
1.1
0.8
1.7
1.5
0.25 0.25 0.03 0.07
2.5
2.0
8°
0°
Note
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT418-2
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-10-29
98-02-25
1999 Apr 08
20