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TDA8586 Datasheet, PDF (10/24 Pages) NXP Semiconductors – Power amplifier with load detection and auto BTL/SE selection
Philips Semiconductors
Power amplifier with load detection and
auto BTL/SE selection
Preliminary specification
TDA8586
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
VP
VDIAG
IOSM
IORM
Vrp
Vsc
Ptot
Tj
Tstg
Tamb
supply voltage
operating
8
load dump protected; −
see Fig.6
voltage on diagnostic pin
−
non-repetitive peak output current
−
repetitive peak output current
−
reverse polarity voltage
note 1
−
AC and DC short-circuit voltage of output pins
−
across loads and to ground or supply pins
total power dissipation
−
junction temperature
−
storage temperature
−55
operating ambient temperature
−40
18
45
18
6
4
6
18
75
150
+150
+150
Note
1. A large reverse current will flow, therefore external protection is needed (fuse and reverse diode).
UNIT
V
V
V
A
A
V
V
W
°C
°C
°C
handbook, halfpage
45 V
VP
14.4 V
tr
tf
MGL404
t (ms)
Fig.6 Load dump voltage waveform.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
Rth(j-c)
PARAMETER
thermal resistance from junction to ambient
thermal resistance from junction to case
CONDITIONS
in free air
VALUE
40
2
UNIT
K/W
K/W
1999 Apr 08
10