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TDA8586 Datasheet, PDF (2/24 Pages) NXP Semiconductors – Power amplifier with load detection and auto BTL/SE selection
Philips Semiconductors
Power amplifier with load detection and
auto BTL/SE selection
Preliminary specification
TDA8586
FEATURES
General
• Operating voltage from 8 to 18 V
• Low distortion
• Few external components, fixed gain
• Automatic mode selection (SE or BTL) depending on
connected ‘rear’ loads
• Can be used as a stereo amplifier in Bridge-Tied Load
(BTL) or quad Single-Ended (SE) amplifiers
• Single-ended mode without loudspeaker capacitor
• Soft clipping, to guarantee good clip behaviour with
inductive loads
• Mute and standby mode with one-pin operation
• Diagnostic information for Dynamic Distortion Detector
(DDD), high temperature (140 °C) mode of operation
and short-circuit
• No switch-on/off plops when switching between standby
and mute and from mute to on
• Load detection on ‘rear’ channels when switching from
standby to mute
• Fast mute on supply voltage drops (low VP mute).
GENERAL DESCRIPTION
The IC incorporates the following functions:
1. 4 × 6 W SE amplifies without SE capacitor, because of
the availability of 2 half supply voltage power buffers
2. 2 × 20 W BTL amplifiers
3. Automatic switching between 2 and 4 speaker
operation. The mode of operation is determined during
start-up.
This amplifier is protected for all general short-circuit
conditions to battery or ground, overvoltage, 45 V load
dump and short-circuits on the speaker outputs.
The IC is contained in a 20-pin power HSOP package, but
is also available in a 17-pin SIL power package. When
packaged in the 20-pin HSOP package additional
functions are available:
1. DDD level selection between 2 and 10%
2. Overrule pin for changing mode of operation
(from SE to BTL or from BTL to SE).
Protection
• Short-circuit proof to ground, positive supply voltage on
all pins and across load
• ESD protected on all pins
• Thermal protection against temperatures exceeding
150 °C
• Load dump protection
• Overvoltage protection.
ORDERING INFORMATION
TYPE
NUMBER
TDA8586Q
TDA8586TH
PACKAGE
NAME
DESCRIPTION
DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
HSOP20 heatsink small outline package; 20 leads; low stand-off
VERSION
SOT243-1
SOT418-2
1999 Apr 08
2