TDA8586 Datasheet, PDF (19/24 Pages) NXP Semiconductors – Power amplifier with load detection and auto BTL/SE selection

Philips Semiconductors
Power amplifier with load detection and
auto BTL/SE selection
PACKAGE OUTLINES
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
Preliminary specification
TDA8586
SOT243-1
non-concave
x
Dh
D
Eh
view B: mounting base side
d
A₂
B
j
E
A
L₃
1
17
Z
e₁
wM
b_p
e
L
Q
c
vM
m
e₂
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A₂ b_p c D⁽¹⁾ d D_h E⁽¹⁾ e e ₁ e ₂ E_h
j
L L₃ m Q
v
w
x Z ⁽¹⁾
mm
17.0
15.5
4.6
4.2
0.75 0.48 24.0 20.0
0.60 0.38 23.6 19.6
10
12.2
11.8
2.54
1.27
5.08
6
3.4 12.4 2.4
3.1 11.0 1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT243-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
97-12-16
1999 Apr 08
19