TDA8004T Datasheet, PDF (17/24 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8004T
More application information on
application report AN97036
VDD for the TDA8004 must be the same as controller
supply voltage, CLKDIV1, CLKDIV2, RSTIN, PRES,
PRES, AUXUC, I/OUC, AUX2UC, RFU1, CMDVCC,
OFF should be referenced to VDD, and also XTAL1
if driven by external clock.
100 nF ^{10 µF}
+5 V
100 nF
100 nF
These capacitors
must be placed
near the IC and
have LOW ESR
(Less than 1 cm)
+3.3 V
100 k
Straight and short
connextions between
CGND, C5 and capacitors
GND. (No loop)
CLKDIV1
1
AUX2UC
28
CLKDIV2
2
AUX1UC
27
+3.3 V ^RFU1 3
I/OUC
26
GNDP
4
S2
5
VDDP ₆
XTAL2
25
XTAL1
24
23 ^OFF
33 pF
S1
7
GND
22
VUP ^{TDA8004T VDD}
8
21
PRES ₉
RSTIN
20
100 nF
+3.3 V
PRES
10
CMDVCC
19
I/O
11
AUX2
12
n.c.
18
17 ^VCC
+3.3 V
AUX1
13
RST
16
CGND ₁₄
15 ^CLK
3.3 V POWERED
MICROCONTROLLER
100 nF
CARD READ
(Normally closed type)
220 nF
C5 C1
C6 C2
C7 C3
C8 C4
K1
K2
One 100nF
with LOW ESR
near pin 17,
One 100nF or 220nF
with LOW ESR
near C1 contact
(less than 1cm)
C3 should be routed
far from C2, C7, C4 and C8
and, better, surrounded
with ground tracks.
MGM179
1999 Dec 30
Fig.10 Application diagram.
17