TDA8004T Datasheet, PDF (16/24 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8004T
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Timing
t_act
t_de
t₃
t₅
activation sequence duration
deactivation sequence duration
start of the window for sending CLK
to the card
end of the window for sending CLK
to the card
see Fig.5
see Fig.6
see Fig.5
see Fig.5
−
180 220
µs
60
80 100
µs
−
−
130
µs
140
−
−
µs
Notes
1. To meet these specifications V_CC should be decoupled to CGND using two ceramic multilayer capacitors of low ESR
with values of either 100 nF or one 100 nF and one 220 nF.
2. The transition times and duty factor definitions are shown in Fig.9; δ = ₍---t--₁---t-₊-¹----t--₂---₎
3. PRES and CMDVCC are active LOW; RSTIN and PRES are active HIGH; for CLKDIV1 and CLKDIV2 see Table 1;
RFU1 must be tied HIGH.
handbook, full pagewidth
tr
90%
tf
90%
10%
10%
t1
t2
VCC or VDD
(VOH + VOL)/2
0
MGM178
Fig.9 Definition of output transition times.
APPLICATION INFORMATION
V_DD for the TDA8004T must be the same as for the microcontroller and CLKDIV1, CLKDIV2, RSTIN, PRES, PRES,
AUX1UC, AUX2UC, I/OUC, RFU1, CMDVCC and OFF should be referenced to V_DD and XTAL1 also when driven by an
external clock.
For optimum layout be sure that there is enough ground area around the TDA8004T and the connector. Place the
TDA8004T very near to the connector, ideally under the connector, and decouple V_DD and V_DDP properly.
Refer to AN97036 for further application information for proper implementation of the TDA8004T.
1999 Dec 30
16