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| Q65110A2486 Datasheet, PDF (7/10 Pages) OSRAM GmbH – NPN-Silizium-Fototransistor im SMT SIDELED®-Gehause Silicon NPN Phototransistor in SMT SIDELED®-Package | |||
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Empfohlenes Lötpaddesignï
Recommended Solderpad Design
SFH 325, SFH 325 FA
3.7 (0.146)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
1.2 (0.047)
Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2
Lötstopplack
Solder resist
MaÃe in mm (inch) / Dimensions in mm (inch).
OHLPY965
2013-01-16
7
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