XOCLCC6EVB Datasheet, PDF (8/9 Pages) ON Semiconductor – Crystal Clock Oscillator Module Evaluation Board Manual for NBX Family

Appendix:
MECHANICAL CASE OUTLINE
GENERIC MARKING DIAGRAM
SOLDERING FOOTPRINT
XOCLCC6EVB
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
4X
0.15 C
D
A
D1
B
E2
TERMINAL 1
INDICATOR
H E1 E
0.10 C
A1
D2
TOP VIEW
A3
A2
A
SIDE VIEW
D3
1
2
e
3
C
SEATING
PLANE
R
E3
0.10 C A B
0.05 C 6X b
6
5
4
BOTTOM VIEW
6X L
SOLDERING FOOTPRINT*
6X
1.50
5.06
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM MIN NOM MAX
A 1.70
1.80
1.90
A1
0.70 REF
A2
0.36 REF
A3 0.08
0.10
0.12
b 1.30
1.40
1.50
D
7.00 BSC
D1 6.17
6.20
6.23
D2 6.66
6.81
6.96
D3
5.08 BSC
E
5.00 BSC
E1 4.37
4.40
4.43
E2 4.65
4.80
4.95
E3
3.49 BSC
e
2.54 BSC
H
1.80 REF
L 1.17
1.27
1.37
R
0.70 REF
GENERIC
MARKING DIAGRAM*
XXXXXXXXX
XXXXXXXXXXXXX
AWLYYWWG
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part mark-
ing.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.54
PITCH
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8