AMIS-30623 Datasheet, PDF (64/65 Pages) AMI SEMICONDUCTOR – LIN Microstepping Motordriver

AMIS-30623
Table 39: Soldering Process
Package
Wave
Soldering Method
Re-flow⁽¹⁾
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable⁽²⁾
Suitable
PLCC⁽³⁾ , SO, SOJ
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended⁽³⁾⁽⁴⁾ Suitable
SSOP, TSSOP, VSO
Not recommended⁽⁵⁾ Suitable
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder
may stick to the heatsink (on top version).
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.65mm.
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
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