BUD42D Datasheet, PDF (11/14 Pages) ON Semiconductor – High Speed, High Gain Bipolar NPN Transistor with Antisaturation Network and Transient Voltage Suppression Capability

BUD42D
200°C
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
STEP 5
HEATING ^HEATING
ZONES 3 & 6 ^{ZONES 4 & 7}
SOAK"
SPIKE"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
150°C
100°C
150°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
T_MAX
Figure 32. Typical Solder Heating Profile
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