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GTL2010 Datasheet, PDF (5/20 Pages) NXP Semiconductors – 10-bit GTL Processor Voltage Clamp | |||
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NXP Semiconductors
GTL2010
10-bit bidirectional low voltage translator
8. Application design-in information
8.1 Bidirectional translation
For the bidirectional clamping conï¬guration, higher voltage to lower voltage or lower
voltage to higher voltage, the GREF input must be connected to DREF and both pins
pulled to HIGH side VCC through a pull-up resistor (typically 200 kâ¦). A ï¬lter capacitor on
DREF is recommended. The processor output can be totem pole or open-drain (pull-up
resistors may be required) and the chip set output can be totem pole or open-drain
(pull-up resistors are required to pull the Dn outputs to VCC). However, if either output is
totem pole, data must be unidirectional or the outputs must be 3-stateable and the outputs
must be controlled by some direction control mechanism to prevent HIGH-to-LOW
contentions in either direction. If both outputs are open-drain, no direction control is
needed. The opposite side of the reference transistor (SREF) is connected to the
processor core power supply voltage. When DREF is connected through a 200 k⦠resistor
to a 3.3 V to 5.5 V VCC supply and SREF is set between 1.0 V to (VCC â 1.5 V), the output
of each Sn has a maximum output voltage equal to SREF and the output of each Dn has
a maximum output voltage equal to VCC.
1.8 V
1.5 V
1.2 V
1.0 V
VCORE
CPU I/O
200 kâ¦
GND
SREF
S1
S2
GREF
DREF
D1
D2
5V
totem pole or
open-drain I/O
VCC
CHIPSET I/O
increase bit size
by using 10-bit GTL2010
or 22-bit GTL2000
3.3 V
S3
D3
S4
D4
S5
D5
Sn
Dn
VCC
CHIPSET I/O
002aac060
Fig 4.
Typical bidirectional voltage translation.
Bidirectional translation to multiple higher voltage levels such as an I2C-bus
application
GTL2010_6
Product data sheet
Rev. 06 â 3 March 2008
© NXP B.V. 2008. All rights reserved.
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