PIP213-12M Datasheet, PDF (18/21 Pages) NXP Semiconductors – DC-to-DC converter power train

NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
0.475
1.40
0.30
9.25 (2×)
8.30 (2×)
6.20 (2×)
0.50
0.25
1.60 0.40
0.45
0.525
7.04
(4 ×)
0.05
0.615
1.90
0.50
0.70 (3×)
e = 0.50
0.80 (2×)
0.29 (56×)
0.075
0.150
0.025
solder lands
Cu pattern
clearance
solder paste
placement area
0.425
7.20 (2×)
9.00 (2×)
0.50
2.00
occupied area
All dimensions in mm
Fig 18. PCB footprint for SOT684-4 package (reflow soldering)
001aaa064
16.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and small
size of the solder lands. A stencil thickness of 0.125 mm is recommended. The stencil
apertures can be made the same size as the solder lands in Figure 18.
The type of solder paste recommended for MLF (Micro Lead-Frame) packages is “No
clean”, Type 3, due to the difficulty of cleaning flux residues from beneath the MLF
package.
PIP213-12M_1
Product data sheet
Rev. 01 — 25 September 2007
© NXP B.V. 2007. All rights reserved.
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