PIP213-12M Datasheet, PDF (14/21 Pages) NXP Semiconductors – DC-to-DC converter power train

NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
14. Package outline
HVQFN56: plastic thermal enhanced very thin quad flat package; no leads;
56 terminals; body 8 x 8 x 0.85 mm
D
B
D1
A
SOT684-4
terminal 1
index area
A4
A
E1 E
c
A1
detail X
C
e1
e
1/2 e
b
vMC AB
y1 _C
y
wM C
15
28
L
14
29
e
Eh1
Eh e2
1/2 e
Eh2
1
terminal 1 ₅₆
index area
Dh1
42
43
Dh2
X
0
2.5
5 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A
max.
A1
A4
b
c D D1 Dh1 Dh2 E E1 Eh Eh1 Eh2 e e1 e2 L v w
y y1
mm
0.9
0.05
0.00
0.70
0.65
0.30
0.18
0.2
8.1
7.9
7.8
7.7
2.65 3.55
2.35 3.25
8.1
7.9
7.8
7.7
6.45
6.15
3.25
2.95
2.85
2.55
0.5
6.5
6.5
0.5
0.3
0.1 0.05 0.05
0.1
OUTLINE
VERSION
IEC
SOT684-4
---
REFERENCES
JEDEC
JEITA
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
03-10-23
04-09-14
Fig 16. Package outline SOT684-4 (HVQFN56)
PIP213-12M_1
Product data sheet
Rev. 01 — 25 September 2007
© NXP B.V. 2007. All rights reserved.
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