PIP213-12M Datasheet, PDF (17/21 Pages) NXP Semiconductors – DC-to-DC converter power train

NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Mounting
16.1 PCB design guidelines
The terminals on the underside of the package are rectangular in shape with a rounded
edge on the inside. Electrical connection between the package and the printed-circuit
board is made by printing solder paste onto the PCB footprint followed by component
placement and reflow soldering. The PCB footprint shown in Figure 18 is designed to form
reliable solder joints.
The use of solder resist between each solder land is recommended. PCB tracks should
not be routed through the corner areas shown in Figure 18. This is because there is a
small, exposed remnant of the lead frame in each corner of the package, left over from the
cropping process.
Good surface flatness of the PCB lands is desirable to ensure accuracy of placement after
soldering. Printed-circuit boards that are finished with a roller tin process tend to leave
small lumps of tin in the corners of each land. Levelling with a hot air knife improves
flatness. Alternatively, an electro-less silver or silver immersion process produces
completely flat PCB lands.
PIP213-12M_1
Product data sheet
Rev. 01 — 25 September 2007
© NXP B.V. 2007. All rights reserved.
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