PIP213-12M Datasheet, PDF (13/21 Pages) NXP Semiconductors – DC-to-DC converter power train

NXP Semiconductors
PIP213-12M
DC-to-DC converter powertrain
The PRDY flag is not used and should be left unconnected on the PCB. The external
boost capacitor should also be connected between CBP and V_O and not CBP and CBN
with the CBN pin being left unconnected on the PCB. In addition, V_SSC pin 7 and V_SSO pin
39 to pin 41 should be left unconnected on the PCB. Note that the sizes of PAD 1, PAD 2
and PAD 3 can vary between different DrMOS vendors. The PCB footprint must be
modified to take the pinning modifications and pad size differences into account.
To ensure footprint compatibility with other DrMOS products, it is recommended that the
latest multiple vendor compatibility PCB footprint contained within the Intel DrMOS
specification is used and that the relevant DrMOS product data sheet is checked for
compatibility.
13. Marking
terminal 1
index area
TYPE No.
DIFFUSION LOT No.
MANUFACTURING CODE
COUNTRY OF ORIGIN
03ao89
TYPE No: PIP213-12M_NN (NN is revision number)
DIFFUSION LOT No: 7 characters
MANUFACTURING CODE; see Figure 15
COUNTRY OF ORIGIN: Korea
Fig 14. SOT684-4 marking
RoHS compliant
G = RoHS indicator
Mask code
N1I = Mask layout version
Diffusion centre
h = Hazel Grove,
UK _hfGYYWWN1I
Assembly centre
f = Amkor Korea
Date code
YY = last two digits of year
WW = week number
03ai72
Fig 15. Interpretation of manufacturing code
PIP213-12M_1
Product data sheet
Rev. 01 — 25 September 2007
© NXP B.V. 2007. All rights reserved.
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