PMEG3010EP115 Datasheet, PDF (10/13 Pages) NXP Semiconductors – Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.

NXP Semiconductors
PMEG3010EP
1 A low V_F MEGA Schottky barrier rectifier
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package
Description
PMEG3010EP SOD128
4 mm pitch, 12 mm tape and reel
[1] For further information and the availability of packing methods, see Section 14.
Packing quantity
3 000
-115
11. Soldering
6.2
4.4
4.2
solder lands
3.4 2.5
1.9 2.1
(2×) (2×)
solder resist
solder paste
occupied area
1.2
(2×)
1.4
(2×)
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD128
Dimensions in mm
sod128_fr
PMEG3010EP_1
Product data sheet
Rev. 01 — 30 December 2008
© NXP B.V. 2009. All rights reserved.
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